Testing

FS Technology has current capabilities to test analog, power, passive, discrete, digital, mixed-signal, logic, memory, high frequency, processors, controllers, and more. We utilize highly trained test engineers, modern test equipment, and advanced proprietary test processes which provide testing coverage for a wide range of devices. A detailed, professional report is included with each test project.

Tests include:

· Level I Visual Inspection to the IDEA 1010B standard to determine whether the component and packaging conform to manufacturer specifications. Solder-ability and co-planarity are measured to ensure ease-of-placement on the manufacturing line.
· Level II De-capsulation to remove the insulation material of the components in order to reveal the die. The die is analyzed for markings (part number, manufacturer name or logo, lot numbers) and architecture to validate the authenticity of the device.
· Level III Electrical/Functionality Test to ensure component performs to manufacturer specifications.
· Level IV Customized test protocols are available upon the customer’s request